Rocking head 12 Deg (24 Deg total) reduces contact point, critical for slicing hard materials such as sapphire and ruby.
Fixed diamond particles electroplated to steel core wire. Wire kerf of 250µm + 5 to 20 micron additional kerf based on diamond wire mfg.
Wire Saw Concept (Slurry) – Meyer Burger DS 261
A slurry (comprised of an abrasive grain and glycol) is directed onto the wire web and transported to the cutting interface by fast moving wire (10 m/sec).
Low kerf loss is provided by a thin wire at 175 µm, an additional 40 µm of material is lost from the grain that is used.
SlicingTech - Contract Wire Saw Wafer Slicing - Diamond Wire Wafer Cutting and Slicing - Wire Sawing - Bangor, PA
Wire Saw Contract Cutting and Wafer Slicing
SlicingTech serves the needs of companies who require high precision, high volume wafer slicing. Along with a wide range of Meyer Burger slicing systems, we now feature the world-renowned, state-of-the-art Meyer Burger DW 288 and Meyer Burger DW 265 Diamond Wire Slicing Systems for hard and brittle materials.
Our Wire Saws provide for slicing diameters up to 385 mm. Large table loading capabilities enable us to slice thousands of parts in as little as a three hour cycle time. This provides our customers with lowest possible price per piece. Our Wire Saws and ID Saws provide for low kerf loss and excellent surface finishes. Sliced parts coming off our wire saws have surface finishes that very often reduce or eliminate additional machining operations, such as grinding or lapping.
Our key strengths are our large installed base of Wire Saws and ID Saws, our "in house" processing of Wire Guide Rolls and our 40+ years of wafer slicing experience. These attributes contribute greatly to our ability to provide quick and efficient deliveries for any specified thickness on a wide variety of material and sizes.
With worldwide service and support, SlicingTech services customers throughout the United States, Europe, Asia and the Middle East.
SlicingTech | 432 Mt. Bethel Hwy, Bangor, PA 18013