Diamond Wire Saw Concept – Meyer Burger DW 288


Rocking head 12 Deg (24 Deg total) reduces contact point, critical for slicing hard materials such as sapphire and ruby.


Fixed diamond particles electroplated to steel core wire. Wire kerf of 250µm + 5 to 20 micron additional kerf based on diamond wire mfg.

Wire Saw Concept (Slurry) – Meyer Burger DS 261


A slurry (comprised of an abrasive grain and glycol) is directed onto the wire web and transported to the cutting interface by fast moving wire (10 m/sec).


Low kerf loss is provided by a thin wire at 175 µm, an additional 40 µm of material is lost from the grain that is used.